윤정원 교수
Our laboratory is aiming to develop reliable bonding materials and processes for fine-pitch semiconductor/electronics packaging and EV/HEV power module packaging applications. We are currently interested in various low- and high-temperature endurable bonding materials (Sn, Cu, Ag, Au base alloys, preforms and pastes) and surface finishes (Cu, Ni, Pd, Au, and etc). We are also trying to develop various advanced electronics systems such as mobile/wearable electronics, car electronics, power conversion modules, and renewable energy modules. |
* Professor 윤정원
* Students BS-MS integrated students : 이동환, 정민성
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- 반도체/전자 패키징 (소재/공정/신뢰성)
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1. Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon*, “Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints”, Applied Surface Science, 503 (2020) 144339
2. Jungsoo Kim, Jong-Hoon Back, Seung-Boo Jung, Jeong-Won Yoon*, “Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin‑Au/Pd/Ni(P) surface‑finished PCBs during aging”, Journal of Materials Science: Materials in Electronics, 31(5) (2020) 4027-4039
3. So-Eun Jeong, Seung-Boo Jung, Jeong-Won Yoon*, “Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications”, Thin Solid Films, 698 (2020) 137873
4. Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon*, “Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint”, Journal of Alloys and Compounds, 820 (2020) 153396
5. Jeong-Won Yoon*, Soyoung Bae, Byung-Suk Lee, Seung-Boo Jung, “Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications”, Applied Surface Science, 515 (2020) 146060
6. Jungsoo Kim, Jong-Hoon Back, Seung-Boo Jung, Jeong-Won Yoon*, “Effects of Ni layer thickness of thin-ENEPIG surface finishes on interfacial reactions and shear strength of Sn-3.0Ag-0.5Cu solder joints during aging”, Journal of Materials Science: Materials in Electronics, 30 (2019) 12911-12923
7. Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon*, “Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints”, Journal of Alloys and Compounds, 805 (2019) 1013-1024
8. Jeong-Won Yoon*, Young-Se Kim, So-Eun Jeong, “Nickel–tin transient liquid phase sintering with high bonding strength for high‑temperature power applications”, Journal of Materials Science: Materials in Electronics, 30 (2019) 20205-20212 포함 SCI(E) 논문 총 132편, 국내 학술진흥재단 등재학술지 총 28편, 미국 및 한국 특허등록 14편 |
